EP2SGX30CF780I3 vs EP2SGX30CF780C7 Vergleich
Detaillierter Direktvergleich von EP2SGX30CF780I3 von Intel und EP2SGX30CF780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX30CF780I3 | EP2SGX30CF780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $171,00 | $171,00 |
| Family | Stratix II GX | — |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | — |
| Maximum Internal Frequency | 622.08 MHz | — |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | — |
| Gehäuse | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FineLine BGA (CF780) |
| Terminal Pitch | 1.0 mm | — |
| Betriebstemperatur | -40 °C to +85 °C (Industrial) | 0C to +85C (commercial) |
| Temperature Grade Suffix | I3 (Industrial) | — |
| Montageart | Surface Mount (BGA) | — |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | — |
| RoHS-Status | [DATA_NEEDED: RoHS status not confirmed in supplied data] | Compliant (lead-free Fineline BGA) |
| Series | — | Stratix II GX |
| Logic Elements | — | 33,000 |
| Embedded Memory | — | 1.9 Mbits |
| DSP Blocks (18x18 multipliers) | — | 256 |
| Maximum User I/O | — | 361 |
| Multi-Gigabit Transceivers | — | 4 channels |
| Transceiver Data Rate | — | 600 Mbps to 3.125 Gbps |
| PLLs | — | 4 |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | C7 (fastest commercial) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG |