EP2SGX30DF780C4 vs EP2SGX30DF780C5N Vergleich
Detaillierter Direktvergleich von EP2SGX30DF780C4 von Intel und EP2SGX30DF780C5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel
EP2SGX30DF780C5N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX30DF780C4 | EP2SGX30DF780C5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Ende des Lebenszyklus | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,00 | $1.050,00 |
| Family | Stratix II GX | — |
| Logic Elements | 33,880 | — |
| Logic Cells | 33,880 | — |
| Number of LABs / CLBs | 1,694 | — |
| Total Number of I/Os | 361 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Number of Transceivers | 20 (embedded multi-gigabit) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Gehäuse | FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) | — |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Operating Temperature Grade | Commercial (C4) | — |
| Programmable Terminals | BGA ball grid (780 terminals) | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| RoHS-Status | Compliant (per manufacturer product page) | Compliant (lead-free finish) |
| Lead-Free | Yes | — |
| Series | — | Stratix® II GX |
| Family Name | — | Stratix II GX |
| Logic Elements / Cells | — | 33,880 |
| LABs / CLBs | — | 1,694 |
| Total RAM Bits | — | 1,369,728 |
| User I/O Count | — | 361 |
| Package Type | — | FC-FBGA-780 |
| Package Size | — | 29 mm x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Betriebstemperatur | — | -40°C to +85°C (extended commercial) |
| Internal Frequency (max) | — | 622 MHz |
| Speed Grade | — | C5 |
| Design Tool | — | Quartus II |