EP2SGX30DF780C4 vs EP2SGX30DF780C5N Comparison

Detailed side-by-side comparison of EP2SGX30DF780C4 by Intel and EP2SGX30DF780C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX30DF780C4 EP2SGX30DF780C5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status End of Life Last Time Buy
Family Stratix II GX —
Logic Elements 33,880 —
Logic Cells 33,880 —
Number of LABs / CLBs 1,694 —
Total Number of I/Os 361 —
Maximum Operating Frequency 717 MHz —
Number of Transceivers 20 (embedded multi-gigabit) —
Core Voltage 1.2 V 1.2 V
Package FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) —
Mounting Type Surface Mount Surface Mount
Process Technology 90 nm CMOS 90 nm CMOS
Operating Temperature Grade Commercial (C4) —
Programmable Terminals BGA ball grid (780 terminals) —
Package Code BGA —
Package Shape Square —
MSL Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
RoHS Status Compliant (per manufacturer product page) Compliant (lead-free finish)
Lead-Free Yes —
Series — Stratix® II GX
Family Name — Stratix II GX
Logic Elements / Cells — 33,880
LABs / CLBs — 1,694
Total RAM Bits — 1,369,728
User I/O Count — 361
Package Type — FC-FBGA-780
Package Size — 29 mm x 29 mm
Ball Pitch — 1.0 mm
Operating Temperature — -40°C to +85°C (extended commercial)
Internal Frequency (max) — 622 MHz
Speed Grade — C5
Design Tool — Quartus II

Datasheets & Resources

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