EP2SGX30DF780I7N vs EP2SGX30DF780I5N Vergleich

Detaillierter Direktvergleich von EP2SGX30DF780I7N von Intel und EP2SGX30DF780I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX30DF780I7N EP2SGX30DF780I5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $188,00 $171,00
Series Stratix II GX —
Family Stratix II GX (Enhanced Configuration / EPC) Stratix II GX
Logic Elements 33,880 LEs —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (bits) 1,369,728 bits —
Total RAM Blocks M512/M4K/M-RAM TriMatrix —
Embedded Multipliers [DATA_NEEDED: 18x18 multiplier count] —
Maximum User I/O 586 user I/O pins —
Multi-Gigabit Transceivers (MGTs) Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps —
MGT Protocols Supported PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE —
Gehäuse 780-ball FineLine BGA —
Core Voltage 1.2 V (typical) 1.2 V
Process Technology 90 nm 90 nm CMOS
Betriebstemperatur -40C to +100C (Industrial) -40C to +85C (Industrial)
Speed Grade 7 (fastest commercial speed grade) I5
Configuration Mode Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status [DATA_NEEDED: RoHS compliance] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Logic Cells — 33,880 (33,380 logic elements)
Logic Array Blocks (LABs) — 33,880
Internal Clock Frequency (max) — 622.08 MHz
Number of Transceivers — [DATA_NEEDED: transceiver count]
Number of Pins / Balls — 780
Package Type — FC-FBGA-780 (Flip-Chip Fine-pitch BGA)
Package Size — 29 x 29 mm, 1.0 mm pitch
Lead-Free / RoHS — Lead Free (per Kynix listing)
Temperature Grade Suffix — Industrial

Datenblätter & Ressourcen

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