EP2SGX30DF780I7N vs EP2SGX30DF780I5N Comparación
Comparación detallada lado a lado de EP2SGX30DF780I7N por Intel y EP2SGX30DF780I5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX30DF780I7N | EP2SGX30DF780I5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $188,00 | $171,00 |
| Series | Stratix II GX | — |
| Family | Stratix II GX (Enhanced Configuration / EPC) | Stratix II GX |
| Logic Elements | 33,880 LEs | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 1,369,728 bits | — |
| Total RAM Blocks | M512/M4K/M-RAM TriMatrix | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| Maximum User I/O | 586 user I/O pins | — |
| Multi-Gigabit Transceivers (MGTs) | Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps | — |
| MGT Protocols Supported | PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE | — |
| Encapsulado | 780-ball FineLine BGA | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40C to +85C (Industrial) |
| Speed Grade | 7 (fastest commercial speed grade) | I5 |
| Configuration Mode | Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | — |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Logic Cells | — | 33,880 (33,380 logic elements) |
| Logic Array Blocks (LABs) | — | 33,880 |
| Internal Clock Frequency (max) | — | 622.08 MHz |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Number of Pins / Balls | — | 780 |
| Package Type | — | FC-FBGA-780 (Flip-Chip Fine-pitch BGA) |
| Package Size | — | 29 x 29 mm, 1.0 mm pitch |
| Lead-Free / RoHS | — | Lead Free (per Kynix listing) |
| Temperature Grade Suffix | — | Industrial |