EP2SGX60CF780C vs EP2SGX60CF780C4 Vergleich

Detaillierter Direktvergleich von EP2SGX60CF780C von Intel und EP2SGX60CF780C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60CF780C EP2SGX60CF780C4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $285,00 $171,00
Family Stratix II GX —
Logic Elements 60,440 60,440
Total Memory Bits 2,544,192 2,544,192
Number of LABs/CLBs 3022 —
Number of User I/O 364 —
Gehäuse 780-BBGA, FCBGA 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch)
Speed Grade C (commercial) C4 (commercial)
Montageart Surface Mount Surface Mount
Embedded Transceivers Multi-gigabit SERDES blocks (per family) —
Betriebstemperatur Commercial (0C to +85C) per -C suffix Commercial (0C to +85C) [DATA_NEEDED: exact TJ range]
I/O Standards Numerous single-ended and differential —
MSL-Level [DATA_NEEDED: MSL level per JEDEC J-STD-020] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Versorgungsspannung [DATA_NEEDED: VCCINT nominal] —
Series Prefix EP2SGX —
Device Family — Stratix II GX
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
LABs/CLBs — 3,022
User I/O Count — 364
Number of Transceivers — [DATA_NEEDED: number of transceivers]
Internal Operating Frequency — up to 732.1 MHz
Propagation Delay — [DATA_NEEDED: propagation delay ns]
Process Technology — 90 nm
Core Supply Voltage — 1.2 V
Package Type — Flip-Chip Fine-Pitch BGA

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