EP2SGX60CF780C4 vs EP2SGX60CF780C3 Vergleich
Detaillierter Direktvergleich von EP2SGX60CF780C4 von Intel und EP2SGX60CF780C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX60CF780C4 | EP2SGX60CF780C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $171,00 | $870,00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 3,022 | — |
| User I/O Count | 364 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | — |
| Internal Operating Frequency | up to 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Process Technology | 90 nm | 90 nm CMOS, SRAM-based |
| Core Supply Voltage | 1.2 V | — |
| Gehäuse | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch |
| Package Type | Flip-Chip Fine-Pitch BGA | — |
| Speed Grade | C4 (commercial) | C3 (commercial) |
| Betriebstemperatur | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | Commercial (0C to +85C junction) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Family | — | Stratix II GX |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Array Blocks (LABs) | — | 3,022 |
| On-chip RAM Bits | — | 2,544,192 (~317 KB) |
| User I/Os | — | 364 |
| Transceivers | — | Up to 12 multi-gigabit transceivers (per family datasheet) |
| Transceiver Data Rate (max) | — | 6.375 Gbps (per Stratix II GX family datasheet) |
| Core Voltage | — | 1.2 V |
| MSL-Level | — | [DATA_NEEDED: MSL level] |