EP2SGX60CF780C4 vs EP2SGX60CF780C3 对比
详细并排对比 EP2SGX60CF780C4 出自 Intel 和 EP2SGX60CF780C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX60CF780C4 | EP2SGX60CF780C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $171.00 | $870.00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 3,022 | — |
| User I/O Count | 364 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | — |
| Internal Operating Frequency | up to 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Process Technology | 90 nm | 90 nm CMOS, SRAM-based |
| Core Supply Voltage | 1.2 V | — |
| 封装 | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch |
| Package Type | Flip-Chip Fine-Pitch BGA | — |
| Speed Grade | C4 (commercial) | C3 (commercial) |
| 工作温度 | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | Commercial (0C to +85C junction) |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Family | — | Stratix II GX |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Array Blocks (LABs) | — | 3,022 |
| On-chip RAM Bits | — | 2,544,192 (~317 KB) |
| User I/Os | — | 364 |
| Transceivers | — | Up to 12 multi-gigabit transceivers (per family datasheet) |
| Transceiver Data Rate (max) | — | 6.375 Gbps (per Stratix II GX family datasheet) |
| Core Voltage | — | 1.2 V |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |