EP2SGX60CF780C4 vs EP2SGX60CF780C3N Vergleich
Detaillierter Direktvergleich von EP2SGX60CF780C4 von Intel und EP2SGX60CF780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX60CF780C4 | EP2SGX60CF780C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $171,00 | $285,00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 3,022 | — |
| User I/O Count | 364 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | — |
| Internal Operating Frequency | up to 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Gehäuse | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | — |
| Package Type | Flip-Chip Fine-Pitch BGA | 780-ball FC-FBGA |
| Speed Grade | C4 (commercial) | — |
| Betriebstemperatur | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | — |
| Montageart | Surface Mount | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | Lead-free / Compliant |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Series | — | Stratix II GX |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| User I/O Pins | — | 364 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 60,440 |
| Internal Frequency (max) | — | 816.9 MHz |
| Transceiver Channels | — | 12 (up to 6.375 Gbps) |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm pitch |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |