EP2SGX60CF780C4 vs EP2SGX60DF780C4 Vergleich
Detaillierter Direktvergleich von EP2SGX60CF780C4 von Intel und EP2SGX60DF780C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX60CF780C4 | EP2SGX60DF780C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $171,00 | $1.350,00 |
| Device Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 3,022 | — |
| User I/O Count | 364 | 364 |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | — |
| Internal Operating Frequency | up to 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Gehäuse | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | — |
| Package Type | Flip-Chip Fine-Pitch BGA | 780-ball FC-FBGA |
| Speed Grade | C4 (commercial) | 4 (C4) |
| Betriebstemperatur | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | Compliant |
| Embedded Memory Bits | — | 2,544,192 |
| Maximum Internal Frequency | — | 717 MHz |
| Transceiver Channels | — | [DATA_NEEDED: exact transceiver count and data rate] |
| Number of CLBs | — | 60,440 |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Commercial (C) |