EP2SGX60CF780C4 vs EP2SGX60DF780C4 Comparaison
Comparaison détaillée côte à côte de EP2SGX60CF780C4 par Intel et EP2SGX60DF780C4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2SGX60CF780C4 | EP2SGX60DF780C4 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $171,00 | $1 350,00 |
| Device Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 3,022 | — |
| User I/O Count | 364 | 364 |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | — |
| Internal Operating Frequency | up to 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Boîtier | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | — |
| Package Type | Flip-Chip Fine-Pitch BGA | 780-ball FC-FBGA |
| Speed Grade | C4 (commercial) | 4 (C4) |
| Température de fonctionnement | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Embedded Memory Bits | — | 2,544,192 |
| Maximum Internal Frequency | — | 717 MHz |
| Transceiver Channels | — | [DATA_NEEDED: exact transceiver count and data rate] |
| Number of CLBs | — | 60,440 |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Commercial (C) |