EP2SGX60DF780C3 vs EP2SGX60DF780C4N Vergleich
Detaillierter Direktvergleich von EP2SGX60DF780C3 von Intel und EP2SGX60DF780C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N ObsoleteSpezifikationsvergleich
| Parameter | EP2SGX60DF780C3 | EP2SGX60DF780C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $218,00 | $365,00 |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | 2,544,192 |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | — |
| Internal Frequency (max) | ~717 MHz | — |
| Gehäuse | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Montageart | Surface Mount | — |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | C4 |
| RoHS-Status | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | Lead-free (per part suffix N) |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | 24,176 |
| User I/Os | — | 364 |
| Embedded Multipliers (18x18) | — | 144 |
| DSP Blocks | — | 36 |
| Transceivers | — | Up to 20 (up to 6.375 Gbps) |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Process Node | — | 90 nm CMOS |
| Maximum Internal Frequency | — | 717 MHz |
| Betriebstemperatur | — | Commercial 0C to +85C |