EP2SGX60DF780C4N vs EP2SGX60DF780C3N Vergleich
Detaillierter Direktvergleich von EP2SGX60DF780C4N von Intel und EP2SGX60DF780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N Obsolete
Spezifikationsvergleich
| Parameter | EP2SGX60DF780C4N | EP2SGX60DF780C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $365,00 | $188,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | — |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| User I/Os | 364 | 364 |
| Total RAM Bits | 2,544,192 | — |
| Embedded Multipliers (18x18) | 144 | — |
| DSP Blocks | 36 | — |
| Transceivers | Up to 20 (up to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Node | 90 nm CMOS | — |
| Gehäuse | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) | — |
| Maximum Internal Frequency | 717 MHz | — |
| Betriebstemperatur | Commercial 0C to +85C | [DATA_NEEDED: operating temperature range C] |
| Speed Grade | C4 | — |
| RoHS-Status | Lead-free (per part suffix N) | Compliant (per distributor listing) |
| Device Type | — | FPGA |
| LABs/CLBs | — | 3,022 |
| Total Memory Bits | — | 2,544,192 |
| Package Type | — | 780-pin FC-FBGA (DF780) |
| Package Dimensions | — | 23 x 23 mm |
| Pitch | — | 1 mm |
| Process Technology | — | 90 nm |
| Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Montageart | — | Surface Mount (BGA) |