EP2SGX60DF780C4N vs EP2SGX60DF780C3N Comparaison
Comparaison détaillée côte à côte de EP2SGX60DF780C4N par Intel et EP2SGX60DF780C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N Obsolete
Comparaison des spécifications
| Paramètre | EP2SGX60DF780C4N | EP2SGX60DF780C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $365,00 | $188,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | — |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| User I/Os | 364 | 364 |
| Total RAM Bits | 2,544,192 | — |
| Embedded Multipliers (18x18) | 144 | — |
| DSP Blocks | 36 | — |
| Transceivers | Up to 20 (up to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Node | 90 nm CMOS | — |
| Boîtier | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) | — |
| Maximum Internal Frequency | 717 MHz | — |
| Température de fonctionnement | Commercial 0C to +85C | [DATA_NEEDED: operating temperature range C] |
| Speed Grade | C4 | — |
| Statut RoHS | Lead-free (per part suffix N) | Compliant (per distributor listing) |
| Device Type | — | FPGA |
| LABs/CLBs | — | 3,022 |
| Total Memory Bits | — | 2,544,192 |
| Package Type | — | 780-pin FC-FBGA (DF780) |
| Package Dimensions | — | 23 x 23 mm |
| Pitch | — | 1 mm |
| Process Technology | — | 90 nm |
| Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Type de montage | — | Surface Mount (BGA) |