EP2SGX60DF780I4 vs EP2SGX60DF780C4 Vergleich
Detaillierter Direktvergleich von EP2SGX60DF780I4 von Intel und EP2SGX60DF780C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel
EP2SGX60DF780I4 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX60DF780I4 | EP2SGX60DF780C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.550,00 | $1.350,00 |
| Family | Stratix II GX | — |
| Device Logic Elements | 60,440 | — |
| Logic Cells / CLBs | 60,440 | — |
| Total RAM Bits | 2,544,192 bits | — |
| User I/O Count | 364 | 364 |
| Transceivers | Embedded multi-gigabit transceivers (MGTs) | — |
| Transceiver Data Rate | [DATA_NEEDED: transceiver data rate in Gbps] | — |
| Internal Maximum Frequency | 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay] | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Gehäuse | 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Speed Grade | I4 (Industrial, speed grade 4) | 4 (C4) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant | Compliant |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 |
| Maximum Internal Frequency | — | 717 MHz |
| Transceiver Channels | — | [DATA_NEEDED: exact transceiver count and data rate] |
| Number of CLBs | — | 60,440 |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | 780-ball FC-FBGA |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Commercial (C) |