Intel

EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel

Teilenummer: EP2SGX60DF780I4 ⚠ Letzte Bestellmöglichkeit

Auf Lager Versand in 1–3 Werktagen

1.2 V Vdss 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) Package 732.1 MHz Speed

Ab $1550 USD / Stück

MOQ: 1 |

Preis aktualisiert: 2026-09-08

Mengenpreise

Menge	Stückpreis	Gesamt
1	$1850	$1.850,00
10	$1780	$17.800,00
100	$1695	$169.500,00
500	$1620	$810.000,00
1.000	$1550	$1.550.000,00

ℹ️ Alle Preise sind in USD

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EP2SGX60DF780I4 Übersicht

The Intel EP2SGX60DF780I4 is a Stratix II GX family Field-Programmable Gate Array (FPGA) with 60,440 logic cells, 364 user I/Os, 2,544,192 bits of embedded memory, and integrated 6.375 Gbps transceivers, housed in a 780-ball FineLine BGA (29 x 29 mm, 1 mm pitch) package. It is fabricated on a 90 nm CMOS process and supports an internal maximum clock frequency of up to 732.1 MHz. The device is rated for industrial temperature operation (-40C to +100C ambient), and the suffix "I4" denotes the industrial speed grade.

An FPGA is an integrated circuit containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as transceivers, memory blocks, and DSP blocks. The Stratix II GX family is Intel's (formerly Altera's) high-end transceiver-rich FPGA family, positioned above the Cyclone and Arria lines and below the Stratix IV/V in the programmable-logic taxonomy: FPGA > Stratix > high-speed serial transceiver FPGA > Stratix II GX. This categorization matters for system architects evaluating performance per dollar and per watt.

Key features of the EP2SGX60DF780I4 include 60,440 logic elements, 2,544,192 embedded RAM bits organized as M512/M4K/M-RAM blocks, embedded 6.375 Gbps multi-gigabit transceivers (MGTs), dedicated DSP blocks, and Phase-Locked Loops (PLLs). The high transceiver count and rich DSP resources make the device a workhorse for parallel signal-processing and high-speed serial I/O applications.

Architecturally, Stratix II GX devices use an adaptive logic module (ALM)-based fabric, an 8-input fracturable LUT, and a column-based DSP/memory floorplan. Compared to Stratix II (non-GX) devices, the GX variant adds hardened PMA-capable transceivers directly bonded to the die, enabling 6.375 Gbps SERDES without consuming fabric logic. This architecture delivers a multi-GHz fabric with deterministic timing closure.

Typical applications include high-speed serial backplane interfaces (XAUI, PCIe Gen1, Serial RapidIO, SDI/HD-SDI), DSP co-processing, software-defined radio (SDR) baseband, and 1G/10G Ethernet MAC bridging. The device's combination of 6.375 Gbps transceivers and embedded DSP is well matched to multi-lane serial protocol bridges and pre-silicon ASIC prototyping.

When designing with the EP2SGX60DF780I4, designers should carefully manage multi-gigabit transceiver PCB routing (controlled-impedance differential pairs, length matching, and AC-coupling capacitors on each lane), provide ample decoupling on VCCINT/VCCA and VTT rails, and ensure thermal management accounts for industrial-temperature operation in enclosed chassis. Power estimation should be performed in the Quartus II Early Power Estimator before PCB layout to size rails correctly.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not aggregated in a single place on the manufacturer datasheet, giving engineers a one-stop reference for part selection, sourcing, and PCB-level integration.

Drop-in-Alternativen für EP2SGX60DF780I4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit EP2SGX60DF780I4 (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, Package Type, Process Technology, Mounting Type.

EP2SGX60DF780C3N

Intel

Package Type: 780-pin FC-FBGA (DF780)

Process Technology: 90 nm

Mounting Type: Surface Mount (BGA)