EP2SGX60DF780I4 vs EP2SGX60DF780I4N Vergleich
Detaillierter Direktvergleich von EP2SGX60DF780I4 von Intel und EP2SGX60DF780I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel
EP2SGX60DF780I4 ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP2SGX60DF780I4 | EP2SGX60DF780I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.550,00 | $1.310,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Logic Elements | 60,440 | — |
| Logic Cells / CLBs | 60,440 | — |
| Total RAM Bits | 2,544,192 bits | — |
| User I/O Count | 364 | — |
| Transceivers | Embedded multi-gigabit transceivers (MGTs) | — |
| Transceiver Data Rate | [DATA_NEEDED: transceiver data rate in Gbps] | — |
| Internal Maximum Frequency | 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay] | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Gehäuse | 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) | FBGA-780 (DF) |
| Montageart | Surface Mount | — |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (industrial) |
| Speed Grade | I4 (Industrial, speed grade 4) | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant | — |
| Logic Elements | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| User I/O Pins | — | 364 |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Package Body Size | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Lead Free | — | Yes |
| RoHS | — | Compliant |
| Maximum Internal Frequency | — | 732.1 MHz |