EP2SGX60DF780I4N vs EP2SGX60EF1152I5N Vergleich

Detaillierter Direktvergleich von EP2SGX60DF780I4N von Intel und EP2SGX60EF1152I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60DF780I4N EP2SGX60EF1152I5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Unknown
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.310,00 $0,00
Family Stratix II GX Stratix II GX
Logic Elements 60,440 —
Logic Array Blocks (LABs) 3,022 —
User I/O Pins 364 —
Embedded Transceivers Yes (multi-gigabit) —
Transceiver Data Rate (max) 6.375 Gbps —
Core Voltage 1.2 V —
Process Technology 90 nm CMOS 90 nm CMOS
Gehäuse FBGA-780 (DF) 1152-ball BGA
Package Body Size 29 x 29 mm —
Ball Pitch 1.0 mm —
Betriebstemperatur -40C to +100C (industrial) —
Lead Free Yes —
RoHS Compliant —
Maximum Internal Frequency 732.1 MHz —
Device Type — Field Programmable Gate Array (FPGA)
Logic Cells — 60,440
Logic Blocks — 60,440
Core Supply Voltage — 1.2 V
Internal Frequency — 717 MHz
Reported Internal Frequency — 609.76 MHz
Maximale Taktfrequenz — 622.08 MHz
Betriebstemperaturbereich — -40 °C to 85 °C
Package Type — FC-FBGA
Package Dimensions — 23 x 23 mm
Terminal Pitch — 1 mm
Number of Terminals — 1152
Terminal Form — Ball
Temperature Grade — Industrial
Propagation Delay — [DATA_NEEDED: propagation delay]
Configuration Memory — [DATA_NEEDED: configuration memory type and size]
I/O Count — [DATA_NEEDED: user I/O count]
Transceiver Count — [DATA_NEEDED: transceiver count]
RoHS-Status — unknown
REACH Status — unknown

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