EP2SGX60EF1152C4 vs EP2SGX90EF1152C3ES Vergleich

Detaillierter Direktvergleich von EP2SGX60EF1152C4 von Intel und EP2SGX90EF1152C3ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2SGX60EF1152C4 EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C4 ⚠ Letzte Bestellmöglichkeit
Intel
EP2SGX90EF1152C3ES EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

EP2SGX90EF1152C3ES ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP2SGX60EF1152C4 EP2SGX90EF1152C3ES
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.067,86 $2.050,00
Device Family Stratix II GX —
Logic Elements (LE) 60,440 —
Logic Array Blocks / CLBs 3022 —
Total RAM Bits 2,544,192 —
User I/O Pins 534 558
Number of LABs/CLBs 3022 —
Package Type 1152-BBGA, FC-FBGA —
Package Pitch 1.0 mm —
Core Voltage 1.15 V to 1.25 V 1.5 V (Enhanced, 'E' suffix)
Internal Frequency 717 MHz (max) —
Propagation Delay [DATA_NEEDED: propagation delay exact value] —
Process Technology 90 nm CMOS —
Speed Grade C4 (commercial) C3
Betriebstemperatur 0C to 85C (commercial) —
Montageart Surface Mount Surface Mount (BGA)
RoHS-Status Compliant Compliant
Lead-Free Yes Yes
Family — Stratix II GX
Process Node — 90 nm
Logic Elements — 90,960
Embedded Memory — 4,520,448 bits (approx. 4.5 Mbit)
Gehäuse — 1152-BBGA (FineLine BGA, 35x35 mm)
Temperature Grade — Commercial Extended (-40 C to +100 C)
High-Speed Transceivers — Up to 12 channels (per Stratix II GX family)
Transceiver Data Rate — Up to 6.375 Gbps per channel (family spec)
DSP Blocks — Yes, dedicated 18x18 multipliers and accumulators
PLL Count — [DATA_NEEDED: PLL count for EP2SGX90 variant]
User I/O Banks — 24 (per package datasheet)
Configuration — SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG

Datenblätter & Ressourcen

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