EP2SGX60EF1152C4 vs EP2SGX90EF1152C3ES 对比

详细并排对比 EP2SGX60EF1152C4 出自 Intel 和 EP2SGX90EF1152C3ES 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX60EF1152C4 EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C4 ⚠ 最后一次采购
Intel
EP2SGX90EF1152C3ES EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

EP2SGX90EF1152C3ES ⚠ 最后一次采购

规格对比

参数 EP2SGX60EF1152C4 EP2SGX90EF1152C3ES
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $1,067.86 $2,050.00
Device Family Stratix II GX —
Logic Elements (LE) 60,440 —
Logic Array Blocks / CLBs 3022 —
Total RAM Bits 2,544,192 —
User I/O Pins 534 558
Number of LABs/CLBs 3022 —
Package Type 1152-BBGA, FC-FBGA —
Package Pitch 1.0 mm —
Core Voltage 1.15 V to 1.25 V 1.5 V (Enhanced, 'E' suffix)
Internal Frequency 717 MHz (max) —
Propagation Delay [DATA_NEEDED: propagation delay exact value] —
Process Technology 90 nm CMOS —
Speed Grade C4 (commercial) C3
工作温度 0C to 85C (commercial) —
安装类型 Surface Mount Surface Mount (BGA)
RoHS 状态 Compliant Compliant
Lead-Free Yes Yes
Family — Stratix II GX
Process Node — 90 nm
Logic Elements — 90,960
Embedded Memory — 4,520,448 bits (approx. 4.5 Mbit)
封装 — 1152-BBGA (FineLine BGA, 35x35 mm)
Temperature Grade — Commercial Extended (-40 C to +100 C)
High-Speed Transceivers — Up to 12 channels (per Stratix II GX family)
Transceiver Data Rate — Up to 6.375 Gbps per channel (family spec)
DSP Blocks — Yes, dedicated 18x18 multipliers and accumulators
PLL Count — [DATA_NEEDED: PLL count for EP2SGX90 variant]
User I/O Banks — 24 (per package datasheet)
Configuration — SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG

数据手册与资源

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