EP2SGX60EF1152I4 vs EP2SGX60EF1152I5 Vergleich
Detaillierter Direktvergleich von EP2SGX60EF1152I4 von Intel und EP2SGX60EF1152I5 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX60EF1152I4 | EP2SGX60EF1152I5 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.395,00 | $178,00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Logic Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Embedded Memory | 2,544,192 bits | — |
| User I/O Pins | 534 | — |
| Maximum Internal Frequency | 717 MHz (per data source) | — |
| Maximum Operating Frequency | 732.1 MHz (per data source) | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.15 V to 1.25 V |
| Gehäuse | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) | 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch |
| Package Dimensions | 23 x 23 mm, 1 mm pitch (per data source) | — |
| Temperature Grade | Industrial | — |
| Montageart | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Family | — | Stratix II GX |
| Logic Elements (LEs) | — | 60,440 |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory (bits) | — | 2,544,192 |
| Maximale Taktfrequenz | — | 622.08 MHz |
| Operating Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 1152 |
| Package Code | — | BGA |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Transceivers | — | Integrated multi-gigabit transceivers (per Stratix II GX family) |
| DSP Blocks | — | Yes, hardware multipliers and DSP blocks (per Stratix II GX family) |