EP2SGX60EF1152I4 vs EP2SGX60EF1152I5 Comparação
Comparação detalhada lado a lado de EP2SGX60EF1152I4 por Intel e EP2SGX60EF1152I5 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2SGX60EF1152I4 | EP2SGX60EF1152I5 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1.395,00 | $178,00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Logic Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Embedded Memory | 2,544,192 bits | — |
| User I/O Pins | 534 | — |
| Maximum Internal Frequency | 717 MHz (per data source) | — |
| Maximum Operating Frequency | 732.1 MHz (per data source) | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.15 V to 1.25 V |
| Encapsulamento | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) | 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch |
| Package Dimensions | 23 x 23 mm, 1 mm pitch (per data source) | — |
| Temperature Grade | Industrial | — |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Family | — | Stratix II GX |
| Logic Elements (LEs) | — | 60,440 |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory (bits) | — | 2,544,192 |
| Frequência máxima de clock | — | 622.08 MHz |
| Operating Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 1152 |
| Package Code | — | BGA |
| Nível MSL | — | [DATA_NEEDED: MSL rating] |
| Transceivers | — | Integrated multi-gigabit transceivers (per Stratix II GX family) |
| DSP Blocks | — | Yes, hardware multipliers and DSP blocks (per Stratix II GX family) |