EP2SGX60EF1152I4N vs EP2SGX60EF1152I3N Vergleich

Detaillierter Direktvergleich von EP2SGX60EF1152I4N von Intel und EP2SGX60EF1152I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2SGX60EF1152I4N EP2SGX60EF1152I4N - 60,440-LCell FPGA, 717 MHz | Intel

EP2SGX60EF1152I4N - 60,440-LCell FPGA, 717 MHz | Intel

EP2SGX60EF1152I4N ✓ Aktiv

Spezifikationsvergleich

Parameter EP2SGX60EF1152I4N EP2SGX60EF1152I3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $1.195,00
Device Type FPGA Field-Programmable Gate Array (FPGA)
Product Family Stratix II GX —
Logic Cells 60,440 —
Embedded Memory 2,544,192 bits —
I/O Count 534 —
Internal Frequency 717 MHz —
Versorgungsspannung 1.2 V —
Gehäuse 1,152-ball FBGA —
Package Type Other, 23 x 23 mm, 1 mm pitch, MS-034AAJ-1, FBGA-484 1152-ball FC-FBGA
Pins 484 —
Device Technology 90 nm —
Logic Blocks 3,022 LABs —
Montageart Surface mount Surface Mount (BGA)
Operating Temperature Grade Industrial —
Compliance [DATA_NEEDED: compliance certification details] —
Transceiver Count [DATA_NEEDED: high-speed transceiver count] —
Configuration Memory [DATA_NEEDED: configuration memory specification] —
Package Pinout [DATA_NEEDED: complete ball-map pinout] —
Family — Stratix II GX
Logic Elements (LEs) — 60,440
Configurable Logic Blocks (CLBs) — 60,440
Embedded Memory Bits — 2,544,192 bits
Internal Frequency (max) — 717 MHz
Process Technology — 90 nm
Core Voltage — 1.2 V
Package Size — 35 x 35 mm (1 mm ball pitch)
Number of Terminals — 1152
Terminal Form — Ball
Temperature Grade — Industrial (-40C to +100C junction)
Lead-Free — Yes
RoHS-Status — Compliant
MSL-Level — [DATA_NEEDED: MSL level]

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