EP2SGX60EF1162I4N vs EP2SGX60DF780I4N Vergleich
Detaillierter Direktvergleich von EP2SGX60EF1162I4N von Altera und EP2SGX60DF780I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX60EF1162I4N | EP2SGX60DF780I4N |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $392,00 | $1.310,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| Embedded Memory | 2,544,192 bits | — |
| DSP Blocks | 12 | — |
| 18x18 Multipliers | 252 | — |
| User I/Os | 534 | — |
| Transceivers | Up to 20 (600 Mbps to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Gehäuse | 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch | FBGA-780 (DF) |
| Speed Grade | I4 (industrial) | — |
| Temperature Range | -40C to +100C (junction) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Mode | Enhanced (EPC) / Fast Passive Parallel (FPP) | — |
| Montageart | Surface Mount (BGA) | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant | — |
| Process Node | 90 nm | — |
| Logic Array Blocks (LABs) | — | 3,022 |
| User I/O Pins | — | 364 |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Process Technology | — | 90 nm CMOS |
| Package Body Size | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Betriebstemperatur | — | -40C to +100C (industrial) |
| Lead Free | — | Yes |
| RoHS | — | Compliant |
| Maximum Internal Frequency | — | 732.1 MHz |