EP2SGX60EF1162I4N vs EP2SGX60DF780I4N Comparación
Comparación detallada lado a lado de EP2SGX60EF1162I4N por Altera y EP2SGX60DF780I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60EF1162I4N | EP2SGX60DF780I4N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $392,00 | $1.310,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| Embedded Memory | 2,544,192 bits | — |
| DSP Blocks | 12 | — |
| 18x18 Multipliers | 252 | — |
| User I/Os | 534 | — |
| Transceivers | Up to 20 (600 Mbps to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Encapsulado | 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch | FBGA-780 (DF) |
| Speed Grade | I4 (industrial) | — |
| Temperature Range | -40C to +100C (junction) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Mode | Enhanced (EPC) / Fast Passive Parallel (FPP) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant | — |
| Process Node | 90 nm | — |
| Logic Array Blocks (LABs) | — | 3,022 |
| User I/O Pins | — | 364 |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Process Technology | — | 90 nm CMOS |
| Package Body Size | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Lead Free | — | Yes |
| RoHS | — | Compliant |
| Maximum Internal Frequency | — | 732.1 MHz |