EP2SGX90EF1152C3N vs EP2SGX90EF1152C5 Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152C3N von Intel und EP2SGX90EF1152C5 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX90EF1152C3N | EP2SGX90EF1152C5 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.280,00 | $225,00 |
| Series | Stratix II GX | Stratix II GX |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | [DATA_NEEDED: LAB count] |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Operating Frequency (max) | 816.9 MHz | — |
| Betriebstemperatur | 0C to +85C (Commercial) | Commercial grade (C5) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | — |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements | — | 90,960 |
| Total RAM Bits | — | 4,520,448 |
| Embedded Multipliers | — | 558 (18x18) |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Number of User I/O | — | [DATA_NEEDED: user I/O count] |
| Gehäuse | — | 1152-BBGA, FCBGA |
| Package Size | — | 35 mm x 35 mm |
| Transceivers | — | Multi-gigabit embedded transceivers |
| RoHS-Status | — | Compliant (per distributor listings) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Supplier Device Package | — | 1152-FBGA (35x35) |