EP2SGX90EF1152C3N vs EP2SGX90EF1152C5 Comparaison
Comparaison détaillée côte à côte de EP2SGX90EF1152C3N par Intel et EP2SGX90EF1152C5 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2SGX90EF1152C3N | EP2SGX90EF1152C5 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 280,00 | $225,00 |
| Series | Stratix II GX | Stratix II GX |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | [DATA_NEEDED: LAB count] |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Operating Frequency (max) | 816.9 MHz | — |
| Température de fonctionnement | 0C to +85C (Commercial) | Commercial grade (C5) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | — |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements | — | 90,960 |
| Total RAM Bits | — | 4,520,448 |
| Embedded Multipliers | — | 558 (18x18) |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Number of User I/O | — | [DATA_NEEDED: user I/O count] |
| Boîtier | — | 1152-BBGA, FCBGA |
| Package Size | — | 35 mm x 35 mm |
| Transceivers | — | Multi-gigabit embedded transceivers |
| Statut RoHS | — | Compliant (per distributor listings) |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |
| Supplier Device Package | — | 1152-FBGA (35x35) |