EP2SGX90EF1152C5 vs EP2SGX90EF1152C3N Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152C5 von Intel und EP2SGX90EF1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX90EF1152C5 | EP2SGX90EF1152C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $225,00 | $1.280,00 |
| Series | Stratix II GX | Stratix II GX |
| Family | Stratix II GX | Stratix II GX |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Logic Elements | 90,960 | — |
| Total RAM Bits | 4,520,448 | — |
| Embedded Multipliers | 558 (18x18) | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | 4548 |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of User I/O | [DATA_NEEDED: user I/O count] | — |
| Gehäuse | 1152-BBGA, FCBGA | — |
| Package Size | 35 mm x 35 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 90 nm | 90 nm |
| Transceivers | Multi-gigabit embedded transceivers | — |
| RoHS-Status | Compliant (per distributor listings) | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Betriebstemperatur | Commercial grade (C5) | 0C to +85C (Commercial) |
| Supplier Device Package | 1152-FBGA (35x35) | — |
| Logic Elements (LE) | — | 90960 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family] |
| Operating Frequency (max) | — | 816.9 MHz |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |
| Speed Grade | — | EF |
| Temperature Grade | — | C3 (Commercial) |