EP2SGX90EF1152C5ES vs EP2SGX90EF1152C3N Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152C5ES von Intel und EP2SGX90EF1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX90EF1152C5ES - Stratix II GX FPGA, 90K LEs, 1152-FBGA | Intel
EP2SGX90EF1152C5ES ObsoleteSpezifikationsvergleich
| Parameter | EP2SGX90EF1152C5ES | EP2SGX90EF1152C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.495,00 | $1.280,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| Embedded Memory (bits) | 4,520,448 | — |
| User I/Os | 558 | 558 |
| Number of Transceivers | 12 (up to 20 channels) | [DATA_NEEDED: transceiver count per family] |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| Gehäuse | 1152-FBGA (FineLine BGA) | — |
| Speed Grade | C5 (commercial, mid-tier) | EF |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Method | Fast passive parallel, active serial, JTAG | — |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Series | — | Stratix II GX |
| Logic Elements (LE) | — | 90960 |
| Number of LABs/CLBs | — | 4548 |
| Total Memory Bits | — | 4520448 |
| Operating Frequency (max) | — | 816.9 MHz |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Montageart | — | Surface Mount |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |
| Temperature Grade | — | C3 (Commercial) |