EP2SGX90EF1152I3 vs EP2SGX90EF1152C3 Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152I3 von Intel und EP2SGX90EF1152C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3 ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP2SGX90EF1152I3 | EP2SGX90EF1152C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.480,00 | $1.180,00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 (4.5 Mbit) |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements (LEs) | — | 90,960 |
| User I/O Count | — | 558 |
| Number of LABs/CLBs | — | 4548 |
| Gehäuse | — | 1152-FBGA (FineLine BGA) |
| Number of Transceivers | — | 12 |
| Transceiver Data Rate | — | 3.125 - 6.375 Gbps |
| Number of PLLs | — | 4 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Speed Grade | — | C3 |
| Betriebstemperatur | — | 0C to +85C (commercial) |