EP2SGX90EF1152I3 vs EP2SGX90EF1152C3 Comparación
Comparación detallada lado a lado de EP2SGX90EF1152I3 por Intel y EP2SGX90EF1152C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX90EF1152I3 | EP2SGX90EF1152C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.480,00 | $1.180,00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 (4.5 Mbit) |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements (LEs) | — | 90,960 |
| User I/O Count | — | 558 |
| Number of LABs/CLBs | — | 4548 |
| Encapsulado | — | 1152-FBGA (FineLine BGA) |
| Number of Transceivers | — | 12 |
| Transceiver Data Rate | — | 3.125 - 6.375 Gbps |
| Number of PLLs | — | 4 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Speed Grade | — | C3 |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |