EP2SGX90EF1152I3 vs EP2SGX90EF1152I3N Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152I3 von Intel und EP2SGX90EF1152I3N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3 ⚠ Letzte BestellmöglichkeitAltera
EP2SGX90EF1152I3N - 90,960 Cell Stratix II GX FPGA 1.2V FC-FBGA-1152 | Altera
EP2SGX90EF1152I3N NrndSpezifikationsvergleich
| Parameter | EP2SGX90EF1152I3 | EP2SGX90EF1152I3N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.480,00 | $1.320,00 |
| Series | Stratix II GX | — |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 (4.5 Mbits) |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | Ball |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | BGA |
| Package Shape | Square | Square |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Family | — | Stratix II GX |
| Logic Elements (LEs) | — | 90,960 |
| Equivalent LEs / CLBs | — | 90,960 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 816.9 MHz |
| Gehäuse | — | 1152-ball FC-FBGA |
| Number of Terminals | — | 1152 |
| Transceivers | — | Multi-gigabit serial transceivers (GX family) |