EP2SGX90EF1152I5 vs EP2SGX90EF1152C3N Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152I5 von Intel und EP2SGX90EF1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX90EF1152I5 | EP2SGX90EF1152C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.320,00 | $1.280,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| Configurable Logic Blocks (CLBs) | 90,960 | — |
| Embedded Memory | [DATA_NEEDED: total bits] | — |
| Transceivers | Up to 20 multi-gigabit transceivers at 6.375 Gbps | — |
| Combinatorial Delay | 4.006 ns | — |
| Maximum Internal Clock Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Gehäuse | 1152-ball FineLine BGA (FBGA-1152) | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Temperature Grade | Industrial (-40C to +100C ambient) | C3 (Commercial) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | — |
| Series | — | Stratix II GX |
| Logic Elements (LE) | — | 90960 |
| Number of LABs/CLBs | — | 4548 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family] |
| Core Voltage | — | 1.2 V |
| Operating Frequency (max) | — | 816.9 MHz |
| Betriebstemperatur | — | 0C to +85C (Commercial) |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |
| Speed Grade | — | EF |