EP2SGX90EF1152I5 vs EP2SGX90EF1152C3N Comparación
Comparación detallada lado a lado de EP2SGX90EF1152I5 por Intel y EP2SGX90EF1152C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX90EF1152I5 | EP2SGX90EF1152C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.320,00 | $1.280,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| Configurable Logic Blocks (CLBs) | 90,960 | — |
| Embedded Memory | [DATA_NEEDED: total bits] | — |
| Transceivers | Up to 20 multi-gigabit transceivers at 6.375 Gbps | — |
| Combinatorial Delay | 4.006 ns | — |
| Maximum Internal Clock Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Encapsulado | 1152-ball FineLine BGA (FBGA-1152) | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Temperature Grade | Industrial (-40C to +100C ambient) | C3 (Commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | — |
| Series | — | Stratix II GX |
| Logic Elements (LE) | — | 90960 |
| Number of LABs/CLBs | — | 4548 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family] |
| Core Voltage | — | 1.2 V |
| Operating Frequency (max) | — | 816.9 MHz |
| Temperatura de funcionamiento | — | 0C to +85C (Commercial) |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |
| Speed Grade | — | EF |