EP2SGX90EF1152I5N vs EP2SGX90EF1152I5 Vergleich

Detaillierter Direktvergleich von EP2SGX90EF1152I5N von Intel und EP2SGX90EF1152I5 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX90EF1152I5N EP2SGX90EF1152I5
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.320,00 $1.320,00
Family Stratix II GX Stratix II GX
Series EP2SGX90 —
Logic Elements (LEs) 90,960 —
Equivalent CLBs 90,960 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Voltage (VCCINT) 1.2 V —
Maximale Taktfrequenz 609.76 MHz —
Combinatorial Delay 4.006 ns 4.006 ns
Package Type FC-FBGA (flip-chip fine-pitch BGA) —
Number of Pins/Balls 1152 —
Package Code BGA BGA
Package Shape SQUARE —
Terminal Form BALL Ball
Operating Temperature Grade INDUSTRIAL (I) —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
Embedded Transceivers Yes (GX series, multi-gigabit PMA) —
On-chip Block Memory [DATA_NEEDED: total M512/M4K/M-RAM bits] —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Montageart Surface Mount Surface Mount
Logic Elements — 90,960
Configurable Logic Blocks (CLBs) — 90,960
Embedded Memory — [DATA_NEEDED: total bits]
Transceivers — Up to 20 multi-gigabit transceivers at 6.375 Gbps
Maximum Internal Clock Frequency — 622.08 MHz
Core Supply Voltage — 1.2 V
Gehäuse — 1152-ball FineLine BGA (FBGA-1152)
Temperature Grade — Industrial (-40C to +100C ambient)

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