EP3C120F484I7N vs EP3C55F484I8N Vergleich
Detaillierter Direktvergleich von EP3C120F484I7N von Intel und EP3C55F484I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C120F484I7N | EP3C55F484I8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $84,70 | $61,50 |
| Family | Cyclone III | — |
| Device Type | FPGA | — |
| Logic Elements | 119,088 | — |
| Logic Array Blocks (LABs) | 7,443 | — |
| Embedded Memory (M9K blocks) | 432 | — |
| Embedded Memory Bits | 3,981,312 (approx. 4 Mbits) | 2,396,160 bits (approximately 234 Kbytes) |
| Embedded Multipliers (18x18) | 288 | 312 |
| Maximum User I/O Pins | 283 | — |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.2 V nominal (1.15 V to 1.25 V) |
| I/O Bank Count | 8 | — |
| Internal Operating Frequency (max) | 472 MHz | — |
| Gehäuse | 484-FBGA (FBGA-484) 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA), 23 mm x 23 mm |
| Betriebstemperatur | -40 °C to +100 °C (industrial, -I7N) | — |
| Speed Grade | 7 (commercial/industrial) | 8 (slowest Cyclone III timing bin) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant (lead-free) | Compliant |
| Halogenfrei | Compliant | — |
| Series | — | Cyclone III |
| Logic Elements (LE) | — | 55,856 |
| Logic Array Blocks (LAB) | — | 3,491 |
| PLLs | — | 4 |
| User I/O Pins | — | 327 |
| I/O Banks | — | 8 |
| Auxiliary Voltage (VCCAUX) | — | 2.5 V nominal |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V per bank |
| Betriebs-Sperrschichttemperatur | — | -40 C to +100 C (industrial, suffix I8) |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Lead-Free | — | Yes |
| MSL-Level | — | 3 |