EP3C120F484I7N vs EP3C55F484I8N 对比
详细并排对比 EP3C120F484I7N 出自 Intel 和 EP3C55F484I8N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C120F484I7N | EP3C55F484I8N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $84.70 | $61.50 |
| Family | Cyclone III | — |
| Device Type | FPGA | — |
| Logic Elements | 119,088 | — |
| Logic Array Blocks (LABs) | 7,443 | — |
| Embedded Memory (M9K blocks) | 432 | — |
| Embedded Memory Bits | 3,981,312 (approx. 4 Mbits) | 2,396,160 bits (approximately 234 Kbytes) |
| Embedded Multipliers (18x18) | 288 | 312 |
| Maximum User I/O Pins | 283 | — |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.2 V nominal (1.15 V to 1.25 V) |
| I/O Bank Count | 8 | — |
| Internal Operating Frequency (max) | 472 MHz | — |
| 封装 | 484-FBGA (FBGA-484) 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA), 23 mm x 23 mm |
| 工作温度 | -40 °C to +100 °C (industrial, -I7N) | — |
| Speed Grade | 7 (commercial/industrial) | 8 (slowest Cyclone III timing bin) |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant (lead-free) | Compliant |
| 无卤 | Compliant | — |
| Series | — | Cyclone III |
| Logic Elements (LE) | — | 55,856 |
| Logic Array Blocks (LAB) | — | 3,491 |
| PLLs | — | 4 |
| User I/O Pins | — | 327 |
| I/O Banks | — | 8 |
| Auxiliary Voltage (VCCAUX) | — | 2.5 V nominal |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V per bank |
| 工作结温 | — | -40 C to +100 C (industrial, suffix I8) |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Lead-Free | — | Yes |
| MSL 等级 | — | 3 |