EP3C16F256I7N vs EP3C5F256C6N Vergleich
Detaillierter Direktvergleich von EP3C16F256I7N von Intel und EP3C5F256C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16F256I7N | EP3C5F256C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $38,50 | $18,85 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 15408 | 5136 |
| Logic Array Blocks (LABs) | 963 | 182 (per DigiKey listing) |
| Total Memory Bits | 516096 | 423936 |
| Embedded Memory | 56 M9K blocks (504 Kbit) | — |
| Embedded 18x18 Multipliers | 56 | 23 |
| PLLs | 4 | 2 |
| Maximum User I/O Pins | 168 | — |
| Gehäuse | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Betriebstemperatur | -40C to +100C (industrial, I7) | 0 C to +85 C (commercial "C6" speed grade) |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | — |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Series | — | EP3C5 |
| Maximum User I/Os | — | 182 |
| Core Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.2 V |
| Montageart | — | Surface Mount |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |
| Configuration Modes | — | Serial, Parallel, JTAG, AS, PS |