EP3C25F324C7N vs EP3C16F484C7N Vergleich
Detaillierter Direktvergleich von EP3C25F324C7N von Intel und EP3C16F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324C7N | EP3C16F484C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $30,10 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | Cyclone III |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | 504 Kbits (M9K blocks) |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | 65 nm TSMC low-power |
| Core Voltage | 1.2 V | 1.2 V (1.15 V to 1.25 V) |
| Gehäuse | 324-ball FBGA | 484-ball FBGA |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Montageart | Surface Mount | — |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Logic Elements | — | 15,408 |
| Embedded Multipliers | — | 56 (18x18) |
| PLLs | — | 4 |
| User I/O Pins | — | 346 |
| Speed Grade | — | -7 |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Maximum Internal Frequency | — | 437.5 MHz |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Configuration Method | — | JTAG (IEEE 1149.1), EPCS serial flash, Active Serial |