EP3C25F324C7N vs EP3C16F484C7N Comparación
Comparación detallada lado a lado de EP3C25F324C7N por Intel y EP3C16F484C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C25F324C7N | EP3C16F484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $30,10 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | Cyclone III |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | 504 Kbits (M9K blocks) |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | 65 nm TSMC low-power |
| Core Voltage | 1.2 V | 1.2 V (1.15 V to 1.25 V) |
| Encapsulado | 324-ball FBGA | 484-ball FBGA |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Tipo de montaje | Surface Mount | — |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Logic Elements | — | 15,408 |
| Embedded Multipliers | — | 56 (18x18) |
| PLLs | — | 4 |
| User I/O Pins | — | 346 |
| Speed Grade | — | -7 |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Maximum Internal Frequency | — | 437.5 MHz |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Configuration Method | — | JTAG (IEEE 1149.1), EPCS serial flash, Active Serial |