EP3C25F324C7N vs EP3C25F324C8 Vergleich
Detaillierter Direktvergleich von EP3C25F324C7N von Intel und EP3C25F324C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324C7N | EP3C25F324C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $23,10 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | — |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | 65 nm CMOS, SRAM-based |
| Core Voltage | 1.2 V | 1.2 V |
| Gehäuse | 324-ball FBGA | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Cyclone III |
| Logic Elements | — | 24,624 LE |
| Logic Array Blocks | — | 1,539 LABs |
| Embedded Multipliers | — | 66 (18 x 18) |
| User I/Os | — | 215 |
| PLLs | — | 4 |
| Speed Grade | — | 8 (commercial) |
| Betriebstemperatur | — | 0 °C to +85 °C (commercial) |
| Maximum Internal Clock | — | 402 MHz |