EP3C25F324I7N vs EP3C25F324C7N Vergleich
Detaillierter Direktvergleich von EP3C25F324I7N von Intel und EP3C25F324C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324I7N | EP3C25F324C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,20 | $0,00 |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | — |
| Embedded Memory | 608,256 bits (66 M9K blocks of 9 Kbits each) | 608,256 bits |
| Embedded 18x18 Multipliers | 66 | — |
| Maximum User I/O Pins | 215 | — |
| LVDS Pairs | 66 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Bank Voltage Range | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) | — |
| Gehäuse | 324-ball FBGA (Fine-Pitch BGA) | 324-ball FBGA |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Speed Grade | 7 (slower speed grade, lower power) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| MSL-Level | 3 (168 hours) | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Cyclone III |
| Logic Cells | — | 24,624 cells |
| Available I/O Pins | — | 215 I/O |
| Maximum Listed Frequency | — | 437.5 MHz |
| Terminal Count | — | 324 terminals |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Rectangular |
| Montageart | — | Surface Mount |
| Temperature Grading | — | Other |
| Programmability | — | Field programmable |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |