EP3C25F324I7N vs EP3C25F324C7N 对比

详细并排对比 EP3C25F324I7N 出自 Intel 和 EP3C25F324C7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3C25F324C7N EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N ✓ 量产中

规格对比

参数 EP3C25F324I7N EP3C25F324C7N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $58.20 $0.00
Family Cyclone III —
Logic Elements (LEs) 24,624 —
Embedded Memory 608,256 bits (66 M9K blocks of 9 Kbits each) 608,256 bits
Embedded 18x18 Multipliers 66 —
Maximum User I/O Pins 215 —
LVDS Pairs 66 —
PLLs 4 —
Global Clock Networks 20 —
Process Technology 65 nm 65 nm
Core Voltage 1.2 V 1.2 V
I/O Bank Voltage Range 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) —
封装 324-ball FBGA (Fine-Pitch BGA) 324-ball FBGA
工作温度 -40C to +100C (Industrial) —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) —
Speed Grade 7 (slower speed grade, lower power) —
RoHS 状态 Compliant [DATA_NEEDED: RoHS status]
Lead-Free Yes —
MSL 等级 3 (168 hours) —
Product Type — Field Programmable Gate Array (FPGA)
Device Family — Cyclone III
Logic Cells — 24,624 cells
Available I/O Pins — 215 I/O
Maximum Listed Frequency — 437.5 MHz
Terminal Count — 324 terminals
Terminal Form — Ball
Package Code — BGA
Package Shape — Rectangular
安装类型 — Surface Mount
Temperature Grading — Other
Programmability — Field programmable
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

数据手册与资源

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