EP3C40F780C6N vs EP3C120F780C7N Vergleich
Detaillierter Direktvergleich von EP3C40F780C6N von Intel und EP3C120F780C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F780C6N | EP3C120F780C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $172,00 | $162,00 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 | — |
| Embedded Memory Bits | 1,161,216 | — |
| Embedded Memory (Kbytes) | 113 | — |
| M9K Memory Blocks | 126 | — |
| Logic Array Blocks (LABs) | 4,065 | — |
| Maximum User I/O Pins | 535 | — |
| PLLs | 4 | 4 |
| Process Technology | 60 nm CMOS | 65 nm low-k |
| Core Voltage | 1.2 V | — |
| Speed Grade | 6 (commercial) | C7 |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-pin FBGA (F780) |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Package Height | 2.6 mm | — |
| Montageart | Surface Mount (FBGA) | Surface Mount (BGA) |
| Lead Free | Yes | — |
| Configuration Method | SRAM, JTAG via USB-Blaster | — |
| RoHS-Status | Compliant | — |
| Series | — | EP3C120 |
| Logic Elements (LE) | — | 119,088 |
| Total Memory Bits | — | 3,981,312 |
| Embedded Memory Blocks (M9K) | — | 432 |
| 18x18 Hardware Multipliers | — | 531 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 429 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Lead-Free / RoHS | — | Yes (suffix N) |
| Configuration Modes | — | AS, AP, FPP, PS, JTAG |