EP3C40F780C7N vs EP3C40F780C6N Vergleich
Detaillierter Direktvergleich von EP3C40F780C7N von Intel und EP3C40F780C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F780C7N | EP3C40F780C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $145,40 | $172,00 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 LE | 39,600 |
| Total RAM Bits | 1,161,216 bits | — |
| Embedded Multipliers | 126 (18x18) | — |
| User I/Os | 535 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Speed Grade | 7 (C7, commercial) | 6 (commercial) |
| Process Node | 65 nm TSMC low-power | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Method | JTAG, Active Serial, Passive Serial | SRAM, JTAG via USB-Blaster |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Moisture Sensitivity Level | MSL3 (per J-STD-020) | — |
| Embedded Memory Bits | — | 1,161,216 |
| Embedded Memory (Kbytes) | — | 113 |
| M9K Memory Blocks | — | 126 |
| Logic Array Blocks (LABs) | — | 4,065 |
| Maximum User I/O Pins | — | 535 |
| Process Technology | — | 60 nm CMOS |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 2.6 mm |
| Montageart | — | Surface Mount (FBGA) |
| Lead Free | — | Yes |
| RoHS-Status | — | Compliant |