EP3C40F780C7N vs EP3C40F780C8N Vergleich
Detaillierter Direktvergleich von EP3C40F780C7N von Intel und EP3C40F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F780C7N | EP3C40F780C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $145,40 | $64,85 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 LE | — |
| Total RAM Bits | 1,161,216 bits | — |
| Embedded Multipliers | 126 (18x18) | — |
| User I/Os | 535 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-ball FBGA, 1.0mm pitch |
| Speed Grade | 7 (C7, commercial) | 8 (C8) |
| Process Node | 65 nm TSMC low-power | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0°C to +85°C (Commercial) |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Method | JTAG, Active Serial, Passive Serial | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Moisture Sensitivity Level | MSL3 (per J-STD-020) | — |
| Series | — | Cyclone® III |
| Logic Elements (LE) | — | 39,600 |
| Total Memory Bits | — | 1,161,216 bits |
| Number of LABs/CLBs | — | 2,475 |
| Embedded Memory Blocks | — | M9K x 126 |
| Embedded 18x18 Multipliers | — | 126 (up to 396 9x9) |
| Number of PLLs | — | 4 |
| Maximum User I/Os | — | 535 |
| Number of I/O Banks | — | 9 |
| Core Voltage | — | 1.15V to 1.25V |
| Montageart | — | Surface Mount (BGA) |
| Process Technology | — | 65nm TSMC low-power |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| RoHS-Status | — | Compliant |