EP3C40F780C7N vs EP3C40F780C8N Comparison

Detailed side-by-side comparison of EP3C40F780C7N by Intel and EP3C40F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C40F780C7N EP3C40F780C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $145.40 $64.85
Family Cyclone III Cyclone III
Logic Elements 39,600 LE โ€”
Total RAM Bits 1,161,216 bits โ€”
Embedded Multipliers 126 (18x18) โ€”
User I/Os 535 โ€”
Package 780-ball FBGA (FineLine BGA) 780-ball FBGA, 1.0mm pitch
Speed Grade 7 (C7, commercial) 8 (C8)
Process Node 65 nm TSMC low-power โ€”
Operating Temperature 0C to +85C (commercial) 0ยฐC to +85ยฐC (Commercial)
Supply Voltage (Core) 1.2 V โ€”
Configuration Method JTAG, Active Serial, Passive Serial โ€”
PLLs 4 โ€”
Global Clock Networks 20 โ€”
Lead-Free / RoHS Yes (N suffix) โ€”
Moisture Sensitivity Level MSL3 (per J-STD-020) โ€”
Series โ€” Cycloneยฎ III
Logic Elements (LE) โ€” 39,600
Total Memory Bits โ€” 1,161,216 bits
Number of LABs/CLBs โ€” 2,475
Embedded Memory Blocks โ€” M9K x 126
Embedded 18x18 Multipliers โ€” 126 (up to 396 9x9)
Number of PLLs โ€” 4
Maximum User I/Os โ€” 535
Number of I/O Banks โ€” 9
Core Voltage โ€” 1.15V to 1.25V
Mounting Type โ€” Surface Mount (BGA)
Process Technology โ€” 65nm TSMC low-power
Configuration Modes โ€” AS, PS, FPP, JTAG
RoHS Status โ€” Compliant

Datasheets & Resources

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