EP3C40F780C8N vs EP3C40F780C8 Vergleich
Detaillierter Direktvergleich von EP3C40F780C8N von Intel und EP3C40F780C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F780C8N | EP3C40F780C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $64,85 | $99,95 |
| Series | Cyclone® III | EP3C40 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | 1,161,216 bits (1134 Kbit) |
| Number of LABs/CLBs | 2,475 | — |
| Embedded Memory Blocks | M9K x 126 | — |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | 126 |
| Number of PLLs | 4 | — |
| Maximum User I/Os | 535 | — |
| Number of I/O Banks | 9 | — |
| Core Voltage | 1.15V to 1.25V | — |
| Betriebstemperatur | 0°C to +85°C (Commercial) | — |
| Speed Grade | 8 (C8) | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) |
| Gehäuse | 780-ball FBGA, 1.0mm pitch | 780-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | 65nm TSMC low-power | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 39,600 |
| Embedded Memory | — | M9K blocks, 486 Kbit total (per family datasheet) |
| General Purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O Pins | — | 535 |
| User I/O Banks | — | [DATA_NEEDED: user I/O bank count] |
| Supported Memory Interfaces | — | DDR, DDR2, QDRII SRAM (via dedicated PHY) |
| Configuration | — | Serial (AS) / Parallel (AP) / JTAG |