EP3C40F780C8N vs EP3C40F780C8 对比
详细并排对比 EP3C40F780C8N 出自 Intel 和 EP3C40F780C8 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C40F780C8N | EP3C40F780C8 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $64.85 | $99.95 |
| Series | Cyclone® III | EP3C40 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | 1,161,216 bits (1134 Kbit) |
| Number of LABs/CLBs | 2,475 | — |
| Embedded Memory Blocks | M9K x 126 | — |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | 126 |
| Number of PLLs | 4 | — |
| Maximum User I/Os | 535 | — |
| Number of I/O Banks | 9 | — |
| Core Voltage | 1.15V to 1.25V | — |
| 工作温度 | 0°C to +85°C (Commercial) | — |
| Speed Grade | 8 (C8) | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) |
| 封装 | 780-ball FBGA, 1.0mm pitch | 780-ball FBGA (FineLine BGA) |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | 65nm TSMC low-power | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| RoHS 状态 | Compliant | Compliant |
| Logic Elements | — | 39,600 |
| Embedded Memory | — | M9K blocks, 486 Kbit total (per family datasheet) |
| General Purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O Pins | — | 535 |
| User I/O Banks | — | [DATA_NEEDED: user I/O bank count] |
| Supported Memory Interfaces | — | DDR, DDR2, QDRII SRAM (via dedicated PHY) |
| Configuration | — | Serial (AS) / Parallel (AP) / JTAG |