EP3C55F484C7 vs EP3C55F484C8 Vergleich
Detaillierter Direktvergleich von EP3C55F484C7 von Intel und EP3C55F484C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3C55F484C7 - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
EP3C55F484C7 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3C55F484C7 | EP3C55F484C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,95 | $138,40 |
| Device Family | Cyclone III | Cyclone® III |
| Logic Elements (LE) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,495 | 3,491 |
| Embedded Memory Bits | 2,396,160 bits | 2,396,160 bits |
| Embedded Memory (M9K blocks) | 260 blocks of 9 Kbit each | — |
| Embedded 18x18 Multipliers | 156 | 312 |
| Maximum User I/Os | 327 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Internal Operating Frequency (max) | 472 MHz | — |
| Process Technology | 65 nm TSMC low-k CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Gehäuse | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height |
| Operating Temperature Grade | Commercial (0 °C to +85 °C) - C7 speed grade | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant (lead-free FBGA) | — |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Configuration Memory Type | SRAM (volatile, requires external flash) | — |
| Logic Elements (LEs) | — | 55,856 |
| User I/Os | — | 327 |
| Maximum Core Frequency | — | 472.5 MHz |
| Speed Grade | — | C8 (commercial, -8) |
| Betriebstemperatur | — | Commercial (0C to +85C) |
| Configuration Modes | — | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) |
| Lead-Free / RoHS | — | Yes (Pb-free FBGA) |
| Versorgungsspannung | — | Core 1.2 V typical, I/O bank dependent |
| I/O Standards Supported | — | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others |